| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method capable of bonding corresponding bumps among bumps formed on an infrared detection element chip and bumps formed on a signal process circuit chip to enable manufacturing with high yield.SOLUTION: A semiconductor device manufacturing method comprises the steps of: bringing a first electronic component including a metal film having a length shorter in a second direction orthogonal to a first direction than in the first direction and a first bump provided on the metal film, and a second electronic component including a metal film having a length shorter in a fourth direction orthogonal to a third direction than in the third direction and a second bump provided on te metal film into contact with each other; and heating the first bump and the second bump in a contacted state to bond the first electronic component and the second electronic component.SELECTED DRAWING: Figure 11 |
