Processing systems and apparatus adapted to process substrates in electronic device manufacturing

摘要

A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects.

主权项

1. An electronic device processing system, comprising:
a first mainframe section including a first housing defining a first transfer chamber and one or more process chambers coupled to the first housing and including a first robot configured to move substrates; a second mainframe section including a second housing defining a second transfer chamber and one or more process chambers coupled to the second housing and including a second robot configured to move substrates; a via pass-through apparatus coupled between the first mainframe and the second mainframe, the via pass-through apparatus providing the only entrance to and exit from the second mainframe section including:
a first pass-through chamber coupled between the first mainframe and the second mainframe, wherein the first pass-through chamber is accessible by both the first robot and the second robot, anda via process chamber adapted to carry out a process on a substrate, the via process chamber located at a different level than the first pass-through chamber, the via process chamber comprising a lift assembly to lift a substrate within the via process chamber, the lift assembly including a hoop-shaped lift frame, a lift actuator coupled to and positioned beneath the lift frame, and a plurality of fingers coupled to the periphery of the lift frame and extending beneath the lift frame to support the substrate; and one or more load lock chambers coupled to the first housing of the first mainframe section on a side of the first mainframe section opposite from the via pass-through apparatus.