| 摘要 |
PURPOSE:To accelerate a wire bonding method by clamping a wire with a piezoelectric element, thereby reducing the weight of a bonding mechanism. CONSTITUTION:The clamping arm 10 of a wire clamping device is branched at the end side into fork shape, a piezoelectric element 12 is provided in the vicinity of the end of one branch 10A, and a clamping plate 14 is mounted at the position faced with the element 12 at the other branch 10B. When an electric field or a magnetic field is applied to the element 12, the element 12 rapidly responds thereto, and elongates longitudinally at a high speed by the electrostrictive or magnetostrictive characteristic, with the result that a wire 16 is rapidly clamped between the element 12 and the plate 14. |
