| 摘要 |
PURPOSE:To make connection and performance of probe-pins for aging easier by using plating electrode patterns as power supplying pads for aging. CONSTITUTION:Plating electrode patterns 1 and chip isolation holes 9 and connecting patterns 3 are provided to film-carrier. The plating electrode patterns 1 are made narrow near the boundary of the frames. The patterns 1 are separated by the chip isolation holes 9 after plating and at the same time plating drawing- out patterns 7 and the plating electrode patterns 1 are separated. With this constitution, the plating electrode patterns 1 can be used as power supplying pads for aging which have larger area as compared with testing pads 3. |
