| 摘要 |
PURPOSE:To effect the firm bonding of an adherend to a substrate, by interposing an adhesive composed of a photo-setting resin containig a transparent or reflective mixture of microspheres between the adherend and the substrate, and irradiating the assembly externally with light, thereby surely curing the adhesive without heating. CONSTITUTION:An adhesive is prepared by mixing, e.g. a photo-setting resin (preferably obtained by adding a photo-sensitizer such as benzophenone to an epoxy resin modified with an acrylate) with preferably 0.3-0.8wt% spherical glass beads 3 having the minimum diameter of 7mu, the maximum diameter of 50mu and average diameter of 20-25mu. The adhesive 2 is applied to a printed circuit board 1. An electrical part 4 is brought into contact with said adhesive 2 to effect the temporary fixing, and then firmly fixed to the board by curing the adhesive 2 with UV irradiation. EFFECT:The incident light is refracted and irregularily reflected by the glass beads 3, and even the part shielded with the electrical part or the adhesive at the inner part are irradiated fully with the UV light to afford sufficiently high adhesive strength. |
