| 摘要 |
PURPOSE:To improve operation efficiency by mounting a vacuum cylinder, which partially contacts with the back of an adhesive tape and evacuates, and a supporting needle, which is set up in the vacuum cylinder and exfoliates a semiconductor chip from the adhesive tape, in the device exfoliating the chip from the adhesive tape. CONSTITUTION:The adhesive tape 15 on which the semiconductor chips 18 severally separated are pasted is fixed to a ring 16, and the vacuum cylinder 11 is contacted with the back of the adhesive tape 15 so that the chips 18' to be exfoliated are located at the central position. A chip supporting needle holder 13 is elevated by a cam 14', the chip supporting needle 12 is contacted with the back of the adhesive tape 15 opposed to the chip 18' to be exfoliated, and the inside of the vacuum cylinder 11 is evacuated. An adsorbing nozzle 17 is contacted with the chip 18' at the same time, and the chip 18' is exfoliated from the adhesive tape 15 by sucking force. The chips 18 are exfoliated successively from the adhesive tape 15 by repeating said process. |
