| 摘要 |
PURPOSE:To enable making easy and to design an improvement of a weight reduction and a cooling performance by forming a boardlike fin through deep press molding, in a captioned radiator on which a heat pipe is applied for cooling of a heating element, such as semiconductor. CONSTITUTION:A boardlike fin 8 provided with plural fins part 6 having an opening par 10 penetrating vertically through a heat conductive metal plate 9 formed through deep pressing. Then, a heating unit fixing part 3 is formed on a part of the fin 8 or a pipe 1 by providing the heat pipe 1 on the fin 8. Heat from a heating element 5 is transmitted to the pipe 1 through a heating unit fixing block 4, then the heat is transmitted rapidly in a horizontal direction through vaporization action and condensation action of a hydraulic liquid. Even a thin material is good enough for the fin 8, and moreover molding of the concave groove 7 by machining process becomes unnecessary as the heat transmitted in a lateral, vertical and lengthwise directions through the fin 8 is radiated from the whole surface of the fins part 6 and cooling can be done rapidly. |
