发明名称 MANUFACTURE OF LEAD FRAME
摘要 PURPOSE:To isolate each lead piece on an insulating film electrically by forming an opening electrically insulating and isolating a plurality of the lead pieces. CONSTITUTION:Common conductors 7, 8 are formed to one side sections of the insulating film, and the connecting wires 9, 10 of the lead pieces 3 are connected concentrically through each connecting wire to the conductors. Concentrical section 11, 12 are each shaped to the common conductors 7, 8 in sections among holes 2 for each pellet, and respective lead piece 3 is each connected to the near concentrical section 11 or 12 by the connecting wire 9 or 10. The lead pieces 3 are electrolytically plated with gold, etc. and gold is evaporated to the electrodes 13 of a semiconductor element, the lead pieces 3 and the electrodes of the semiconductor element are bonded, and holes 14, 15 for isolation severally containing each concentrical section 11, 12 are bored to the insulating film 1. Accordingly, respective lead piece is mutually isolated electrically while they can simply be manufactured through electrolytic plating.
申请公布号 JPS57184245(A) 申请公布日期 1982.11.12
申请号 JP19810183309 申请日期 1981.11.16
申请人 NIPPON DENKI KK 发明人 HINO MASAO;SATOU SUSUMU;WATANABE AKIRA;KASUGA TOSHIO
分类号 H01L23/48;H01L23/495 主分类号 H01L23/48
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