| 摘要 |
PURPOSE:To agitate solder liquid to the extent of not waving its surface parts and to prevent the deterioration of said liquid by providing a pump in a solder tank, sucking the solder liquid near the bottom part and discharing the same from the surface parts. CONSTITUTION:When a motor 19 is run, the vane wheel 17 of a pump 15 rotates, and the solder liquid 13 near the bottom part in a solder tank 11 is sucked through the bottom opening of a casing 16. This liquid is discharged through a discharged port formed horizontally in the upper part of the casing 16. Gentle flow is generated from the side provided with the pump 15 toward the other side in the surface parts of the solder liquid 13. At this time, if the discharged pressure of the pump 15 is set at about the extent that the surface of the liquid 13 is not waved, this flow abuts on the inside wall on the other side of the tank 11 and descends. Again it returns to the bottom opening part of the casing 16 and is sucked therethrough. Therefore, the entire part of the liquid 13 is agitated gently, and the concentration of impurities such as copper contents on the surface of the solder liquid 13 is prevented. |
