发明名称 |
Substrate cleaning apparatus and substrate processing apparatus |
摘要 |
A substrate cleaning apparatus which can sufficiently clean a pen-sponge in its entirety, and can prevent particles, which have been once removed, from being reattached to the pen-sponge is disclosed. The substrate cleaning apparatus includes: a substrate holder configured to hold and rotate a substrate; a sponge cleaning tool to be brought into contact with a surface of the substrate; a cleaning element provided adjacent to the substrate held by the substrate holder; and a cleaning-tool moving mechanism configured to bring the sponge cleaning tool into contact with the cleaning element. The cleaning element has a cleaning surface that is to come in contact with the sponge cleaning tool, and a central portion of the cleaning surface is located at a higher position than a portion, of the cleaning surface, outside the central portion. |
申请公布号 |
US9466512(B2) |
申请公布日期 |
2016.10.11 |
申请号 |
US201414573390 |
申请日期 |
2014.12.17 |
申请人 |
EBARA CORPORATION |
发明人 |
Ishibashi Tomoatsu |
分类号 |
B24B37/00;H01L21/67;B24B37/34 |
主分类号 |
B24B37/00 |
代理机构 |
Pearne & Gordon LLP |
代理人 |
Pearne & Gordon LLP |
主权项 |
1. A substrate cleaning apparatus comprising:
a substrate holder configured to hold and rotate a substrate; a sponge cleaning tool to be brought into contact with a surface of the substrate; a cleaning element provided adjacent to the substrate held by the substrate holder; and a cleaning-tool moving mechanism configured to bring the sponge cleaning tool into contact with the cleaning element, the cleaning element having a cleaning surface that is to come in contact with the sponge cleaning tool, and a central portion of the cleaning surface being located at a higher position than a portion, of the cleaning surface, outside the central portion, wherein the cleaning element has a central outlet located in the central portion of the cleaning surface, and a fluid passage communicating with the central outlet, and a fluid supply line, which is configured to supply fluid to the fluid passage, is coupled to the cleaning element. |
地址 |
Tokyo JP |