| 摘要 |
<p>PURPOSE:To enable to improve the mounting density of a semiconductor device by soldering a wiring terminal having low thermal resistance in a wide area on the bottom surface, and providing the other wiring terminal on the side surface, thereby improving the heat sink effect. CONSTITUTION:A semiconductor memory chip 10 is fixed and placed through a layer 13 of Au and Si on the chip stage 3 of a chip carrier, and the bonding pad 11 of the chip 10 and the internal wirings 4 of the chip carrier are connected. Desired wirings of the wirings 4 are led out to the bottom surface of the substrate 1 via through holes 19a, 19b, and are connected to pads 20a, 20b for fixing the chip selection terminal having a wide area. Chip selection terminals 21a, 21b are respectively fixed via solder 9 such as silver alloy to the pads 20a, 20b. The others of the wirings 4 are led out to two side surfaces parallel with each other of a substrate 1.</p> |
