发明名称 Resistively heated shape memory polymer device
摘要 A resistively heated shape memory polymer device is made by providing a rod, sheet or substrate that includes a resistive medium. The rod, sheet or substrate is coated with a first shape memory polymer providing a coated intermediate unit. The coated intermediate unit is in turn coated with a conductive material providing a second intermediate unit. The second coated intermediate unit is in turn coated with an outer shape memory polymer. The rod, sheet or substrate is exposed and an electrical lead is attached to the rod, sheet or substrate. The conductive material is exposed and an electrical lead is attached to the conductive material.
申请公布号 US9476412(B2) 申请公布日期 2016.10.25
申请号 US201313829183 申请日期 2013.03.14
申请人 Lawrence Livermore National Security, LLC 发明人 Marion, III John E.;Bearinger Jane P.;Wilson Thomas S.;Maitland Duncan J.
分类号 F03G7/06 主分类号 F03G7/06
代理机构 代理人 Scott Eddie E.
主权项 1. A method of making a resistively heated shape memory polymer device, comprising the steps of: providing a conductive substrate including a resistive medium, coating said conductive substrate with a first shape memory polymer, coating said first shape memory polymer coated conductive substrate with a first conductive material member, coating said first conductive material member coated first shape memory polymer coated conductive substrate with a second shape memory polymer, exposing a portion of said conductive substrate and exposing a portion of said first conductive material member, attaching a first electrical lead to said exposed portion of said conductive substrate, and attaching a second electrical lead to said exposed portion of said first conductive material member; wherein (a) the first shape memory polymer directly contacts the first conductive material member; (b) the conductive substrate directly contacts the first shape memory polymer, and (c) the first conductive material member directly contacts the second shape memory polymer.
地址 Livermore CA US