发明名称 AUTOMATIC POWER DISCONNECT METHOD
摘要 Coupling an electrical connector to a printed circuit board (PCB) involves disposing forms of conductive bonding agent on the PCB, pressing spring-loaded power pins of an electrical connector towards a surface of the PCB, heating the forms of conductive bonding agent, thereby at least partially melting the forms, pressing the spring-loaded power pins into the melted forms of conductive bonding agent, and holding the power pins in the forms until the forms have cooled enough to form a bond that holds the power pins, thereby forming an electrical connection between the one or more pins and the PCB. The spring-loaded power pins are configured to automatically lift away from the surface of the PCB when the bond is weakened.
申请公布号 US2016316571(A1) 申请公布日期 2016.10.27
申请号 US201615202226 申请日期 2016.07.05
申请人 Western Digital Technologies, Inc. 发明人 RICE ALAN P.;PRATAMA ANDRE;WILSON JEFFREY ALAN;FELFELI FIROUZ
分类号 H05K3/34;H01R12/72;H01R43/20 主分类号 H05K3/34
代理机构 代理人
主权项 1. A method of coupling an electrical connector to a printed circuit board (PCB), the method comprising: securing at least a portion of a housing of an electrical connector to a printed circuit board (PCB), the electrical connector comprising one or more spring-loaded power pins; disposing one or more forms of conductive bonding agent on the PCB; pressing one or more spring-loaded power pins of the electrical connector towards a surface of the PCB; heating the one or more forms of conductive bonding agent, thereby at least partially melting the one or more forms of conductive bonding agent; pressing the one or more spring-loaded power pins into the at least partially melted one or more forms of conductive bonding agent; and holding the one or more spring-loaded power pins in the one or more forms until the one or more forms have cooled enough to form a bond that holds the one or more pins, thereby forming an electrical connection between the one or more pins and the PCB; wherein the one or more spring-loaded power pins are configured to substantially automatically lift away from the surface of the PCB when the bond is at least partially weakened.
地址 Irvine CA US