发明名称 |
MOUNTING BODY MANUFACTURING METHOD AND ANISOTROPIC CONDUCTIVE FILM |
摘要 |
A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step. |
申请公布号 |
US2016316569(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
US201415104452 |
申请日期 |
2014.12.10 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
YAMADA Yasunobu;SEKIGUCHI Morio;KUMAKURA Susumu |
分类号 |
H05K3/22;H05K3/32;H05K1/03;H05K1/18 |
主分类号 |
H05K3/22 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a mounting body comprising:
a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness K of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness A of the binder and an average particle diameter B is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step. |
地址 |
Tokyo JP |