| 发明名称 |
PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC COMPONENT MODULE |
| 摘要 |
A printed circuit board, a method of manufacturing a printed circuit board, and an electronic component module including a printed circuit board are provided. The printed circuit board includes a circuit board having a cavity, and a connection board including metal patterns, the connection board disposed in the cavity with the metal patterns disposed substantially vertically in the circuit board. |
| 申请公布号 |
US2016316557(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201514871357 |
申请日期 |
2015.09.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Jeong-Ho;KWEON Young-Do;KIM Hyoung-Joon;HARR Kyoung-Moo;OH Kyung-Seob |
| 分类号 |
H05K1/11;H05K3/00;H05K1/02;H05K1/18;H05K3/46 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a circuit board having a cavity; and a connection board comprising metal patterns, the connection board disposed in the cavity with the metal patterns disposed substantially vertically in the circuit board. |
| 地址 |
Suwon-si KR |
