| 摘要 |
PURPOSE:To attain accurate head polishment and to make the circuit integration easy at the manufacture of a head element, by forming each polishment electrode just above an insulating substrate and connecting a part of one end of each electrode on a conductive lower magnetic substance layer formed on the insulating substrate. CONSTITUTION:Polishing electrodes 5, 6 are formed just above the insulating substrate 1 and only the parts 5c, 6c are formed on a conductive lower magnetic substance layer 2. A magnetic head current flows between bonding pads 3a, 9a, and an electric signals of the electrodes 5, 6 is detected between bonding pads 5a, 9a and between 6a, 9a. Since the electrodes 5, 6 and the bonding pads 5a, 6a are provided just above the substrate 1, even if polishment is performed to B-B' plane with a conventional polishment and droops 11a, 11b due to the electrode polishment are caused, the bonding pads and the electrodes are not electrically short-circuited, allowing to attain highly accurate polishment. The number of the bonding pads is halved than those of conventional systems, giving convenience for the circuit integration at the manufacture of the head element. |
