| 摘要 |
PURPOSE:To strengthen the juncture between a metal collector or a metal terminal and an armor and improve preservation property and performance of antileakage against liquid by interposing a mixture layer composed of a thermoplastic resin and metal powder in a seal boundary in order to couple those components while hot-pressing them at a temperature higher than the melting temperature of a solder layer. CONSTITUTION:A solder layer 30 is formed of solder made of an alloy of tin and lead on a junction face of a negative pole collector plate 16, and posseessing a comparatively low melting temperature not exceeding a decomposition temperature of a polyisobutylene. The junction face side surface of a mixture layer 28 cut in a film shape is treated with acid while removing an oxide on the copper powder surface followed by applying flux to be overlapped on the solder layer 30 and successively hot-pressed. Thereby a part of the alloy of tin and lead is diffused into copper powder dispersed on the junction face side of a mixture layer 28 and as the result of so-called soldering, the negative pole collector 16 is firmly joined to the mixture layer 28. Subsequently, armor 20 is laminated on the negative collector plate 16 whose surface is joined with the mixture layer 28, while being hot-pressed so as to thermally fuse polyisobutylene and polyethylene inside of the armor as well as to strongly join the negative collector 16 to the armor 20. |
