| 摘要 |
PURPOSE:To improve the mount density of an integrated circuit and thus easily perform the mounting work of the IC by a method wherein a plurality of IC sockets are connecting and formed in an integral body with resin. CONSTITUTION:The socket body 1 has socket part including contacts 2 and terminals 3 in a plurality 6-1-6-n are molded in an integral body with the resin. A holding cap 4 is pivotally supported by a shaft part 1a and then energized to the direction of opening always by means of a spring 7. Then, since the plurality of the IC's are pressed at one action by means of the holding cap 4; therefore the operation property thereof extremely improves. |
