发明名称 MANUFACTURE OF SEMICONDUCTOR LIGHT EMITTING ELEMENT ARRAY
摘要 PURPOSE:To prevent a conductive adhesive from creeping etc. in case of die- bonding by a method wherein multiple grooves are provided on a substrate corresponding to the array of LED pellets. CONSTITUTION:Firstly grooves 5 are provided on the gaps of LED pellets arrayal on a substrate 3 and secondly the arrayal excluding the grooves 5 is coated with conductive adhesive 2 by screen-printing and the like to mount the LED pellets 1 thereon by pressure fixing. Thirdly the substrate 3 whereon the LED pellets are mounted is exposed to atmosphere at 150 deg.C to thermoset the conductive adhesive. Through these procedures, the conductive adhesive 2a softened to be liquefied dangles in the grooves 5 preventing it from overflowing along the sides of the LED pellets 1.
申请公布号 JPS5965490(A) 申请公布日期 1984.04.13
申请号 JP19820175160 申请日期 1982.10.05
申请人 RICOH KK 发明人 KAMEI YOUJIROU
分类号 G09F9/33;H01L33/62 主分类号 G09F9/33
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