| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state imaging device in which a translucent member and an image sensor are in close contact, without filling with an adhesive.SOLUTION: A solid state imaging device has a light-receiving element holding member for holding a light-receiving element outputting a predetermined signal depending on the incident light, a cover member connected to the light incident side of the light-receiving element holding member, so that the interval to the light-receiving element will be constant and passing the incident light to the light-receiving element, a translucent member having translucency in which an optical element region having a predetermined optical function is formed on a surface facing the light-receiving element, and a buffer member having elasticity disposed between the cover member and translucent member, and passing the incident light to the light-receiving element. The optical element region is pressed against the light-receiving element by the elasticity of the buffer member supported by the cover member.SELECTED DRAWING: Figure 1 |
