| 摘要 |
PURPOSE:To obtain an LSI package at low cost by a method wherein the outer frame of a lead frame is formed into glass sealing type supported through the intermediary of a supporting lead. CONSTITUTION:A plurality of leads 8, to be adhered in a pinched state between the first casing 1 and the second casing 3 through the intermediary of glass 9, are provided. Said leads 8 are made of a thin plate such as Kovar, iron- nickel alloy and the like by performing etching and pressig works. Inside the package part 10 of said leads 8, they are extended along the upper surface of the second casing 3, and they are curved at two places outside the package part 10. The LSI element consisting of a silicon plate having 9,000 pieces of elements, for example, are fixed on the inner surface of the package part 10 of a supporting plate 4 through the intermediary of a gold-silicon eutectic metal 12. The electrode of a pellet 13 and the inner end of a lead 8 are connected by a wire. |
