| 摘要 |
A semiconductor substrate 1, for example a silicon chip, is mounted on a backing plate 3 for building into an optical arrangement, for example a liquid crystal light valve. An optically flat plate 9 is pressed against the upper side of the silicon chip in a direction towards the backing plate and towards a ring-shaped seal 5 which surrounds a liquid adhesive material 7. The liquid adhesive material distributes the compressive force hydrostatically in order to ensure optical flatness and automatic compensation for the amount of liquid adhesive material within the ring-shaped seal. The optical flatness of the semiconductor substrate is only limited by the flatness of the plate against which it is pressed. Parallelism between the optically flat plate 9, the substrate 1 and the backing plate 3 is achieved using a laser pencil 20 which is reflected through the semiconductor substrate and forms an interference pattern which is observed while the parallelism is adjusted to obtain the greatest possible distance between the interference lines. <IMAGE> |
