| 摘要 |
PURPOSE:To make it possible to form a metal compound film of good film properties and good adhesion, by forming the lowermost and uppermost layers of a film from an electroconductive material and a metal compound, respectively, and effecting the sputtering treatment by application of a negative voltage to the plastic. CONSTITUTION:In forming a film on a plastic (e.g., polycarbonate or polyacrylate) by sputtering, the formation of said film is carried out in such a manner that the film to be formed consists of a double-layer comprising an elctroconductive material (e.g., Cr, Ni, or Ti) and a metal compound (e.g., TiO2, Al2O3, or SiC); at least the lowermost layer of the film is formed from the electroconductive material and at least the uppermost layer of the film is formed from the metal compound, and sputtering is carried out by application of a negative voltage to the plastic. This process makes it possible to form a metal compound film of good film properties, which is difficult to produce by a conventional sputtering process. It is thus possible to widen its application field so as to meet a variety of requirements such as abrasion resistance and decorative performance. |
