发明名称 EXTRUSION MOLDING RESIN COMPOSITION
摘要 PURPOSE:To provide the titled compsn. having excellent heat-sealability, by melt-mixing low-density PE, an ethylene/alpha-olefin copolymer, a low crystalline to amorphous ethylene/alpha-olefin copolymer and a tackifier. CONSTITUTION:10-60wt% low-density PE (A) having a density of 0.91-0.94g/ cm<3> obtd. by radical polymn. in the presence of a polymn. initiator such as an azo compd. under a reaction pressure of 1,000-3,000atm, 20-70wt% ethylene/ C3-C8 alpha-olefin copolyme (B) having a 3-8C alpha-olefin content of 0.2-8mol%, an MI of 0.5-30g/10min and a density of 0.91-0.95g/cm<3>, 10-50wt% low-crystalline to amorphous ethylene/C3-C4 alpha-olefin copolymer (C) having a 3-4C alpha- olefin content of 5-30mol%, an MI of 0.5-30g/10min and a density of 0.85- 0.90g/ cm<3> and 5-30wt% tackifier (D) such as rosin are melt-mixed together to obtain an extrusion molding, resin compsn. having an MI of 1-30g/10min (190 deg.C).
申请公布号 JPS59179643(A) 申请公布日期 1984.10.12
申请号 JP19830056650 申请日期 1983.03.31
申请人 MITSUI DEYUPON PORIKEMIKARU KK 发明人 KATAGIRI MIKIO;HIROSHIGE KUNIE;HIRANO SATOSHI
分类号 C08L23/00;B32B27/32;C08L1/00;C08L7/00;C08L21/00;C08L23/04;C08L23/06;C08L23/08;C08L23/16;C08L101/00 主分类号 C08L23/00
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