摘要 |
PURPOSE:To prevent paint film from exfoliation and copper plating portions from over-grinding by polishing removably the paint film after it is formed on the whole surface of copper plating portions as conductive metal film. CONSTITUTION:In an apparatus for removing paint film provided on a base plate of a printed substrate, a base 11 is provided with a bed 13 on which a cylindrical body 14 and a XY stage 15 are provided. Next, when high pressure air is sent into an air spindle 27, a tool 22 rotates on its own rotary axis 30 while its center revolves along the locus shown by the broken line C with 50- 300rpm of low speed in the direction of arrow D to perform the planetary motion on a circle 36 while polishing removably the paint film for forming a circular electrode portion on a matter 33. Thus, the paint film is prevented from exfoliation and copper plating portions are preventing from overgrinding. |