发明名称 |
ELECTRONIC CIRCUIT CHIP CONNECTION ASSEMBLY AND METHOD |
摘要 |
The technical field of the invention concerns electronic circuit packaging in general and in particular interconnecting an electronic circuit chip to a printed circuit board. The assembly (20) includes a pressure connection plate (24) which receives the electronic circuit chip (30). Contacting the chip (30) as received on the pressure connection plate (24) is an electronic circuit connection means (26) which also contacts the electrically conductive traces (32) on the printed circuit board (34). The pressure connection plate (24) together with the electronic circuit chip (30) received thereon and with the electronic circuit connection means (26) is enclosed by a cover (22) such that the electronic circuit chip (30) may be positioned immediately adjacent to the printed circuit board (34). Securing the cover (22) to the printed circuit board (34) completes formation of the assembly (20) thereby couplign the electronic circuit chip (30) to the traces (32) of the printed circuit board (34). |
申请公布号 |
WO8500467(A1) |
申请公布日期 |
1985.01.31 |
申请号 |
WO1983US01069 |
申请日期 |
1983.07.11 |
申请人 |
SILICON CONNECTION, INC. |
发明人 |
SCHROEDER, JON, MURRAY |
分类号 |
H05K3/32;H01L21/60;H01L23/48;H01L23/498;H05K1/18;H05K3/36;H05K7/10;(IPC1-7):H01L23/48 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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