| 摘要 |
PURPOSE:To improve the level of moisture resistance by preventing the infiltration of water from the interface between a heat dissipating plate and a molded resin by forming a band-formed copper foil pattern on a copper foil, and then using the plate surrounded with said pattern and the crushed section of both surfaces or one surface in the outer periphery of the plate, around the area for mounting semiconductor elements. CONSTITUTION:The area 6 for mounting semiconducltors is surrounded with the crushed part 5 in the outer periphery and said pattern 14. A lead frame is superposed on the plate so that the area 6 for mounting semiconductors of the plate may become coincident with the chip mounting land 7 of the lead frame, and the land 7 is adhered to the area 6 by soldering, etc., resulting in obtaining an insulation type lead frame with heat dissipating plate. Then, the titled device of insulation type of Darlington transistor array with resin sealed heat dissipating plate is produced by the same manufacture as conventional in the processes thereinafter. |
