| 摘要 |
PURPOSE:To inhibit the emission of electromagnetic waves from the title device and further to prevent the mutual interference of circuits in the same chip and the influence of electromagnetic waves by a method wherein the surface of a semiconductor element or the inside and outside of a package is coated with an electromagnetic wave absorbing film. CONSTITUTION:In this device consisting of a ceramic laminated casing 1, a chip die-bonding resin 2, the semiconductor integrated circuit element 3, pads 5, wires 6, inner leads 7, sealings 8, a metal cap 9, and leads 10, the surface of the element 3, the internal surface of the metal cap 9, and further the sides of the leads 10 outside the package are coated with resin films 4, 4', and 4'' with an electromagnetic absorbing substance such as ferrite mixed in. Thereby, the electromagnetic waves generating from the circuit in the element are absorbed to the resin films of said substance, most part thereof is then converted into heat; therefore the noise as the whole element can be largely reduced, resulting in the improvement of element characteristics. |
