| 摘要 |
PROBLEM TO BE SOLVED: To achieve management such that an amount of cut by a cutting blade is a predetermined amount required to completely cut a wafer, without dropping cutting efficiency.SOLUTION: A dividing method for a wafer W1 comprises: an exposed area cutting step in which a cutting blade 60 is lowered to a lowering position where a wafer W1 set in advance is completely cut and the cutting blade 60 is allowed to cut an exposed area E; an imaging process in which an area E1 of the exposed area E, which is cut by the cutting blade 60 in the exposed area cutting step, is imaged by imaging means 68; a determination step in which it is determined by an image picked up by the imaging process, whether the wafer W1 can be completely cut or not; and an adjustment step in which an amount by which the cutting blade 60 is lowered is increased in accordance with a determination made in the determination step.SELECTED DRAWING: Figure 8 |
