发明名称 Method for the formation of buried gates of a semiconductor device utilizing etch and refill techniques
摘要 A method for the formation of buried gates in a semiconductor device using epitaxial growing method combined with diffusion method or diffusion by an additional heat treatment. The buried gate has smaller gate resistance by providing relatively high impurity concentration and also having good reverse characteristic by providing relatively low impurity concentration at the top of the buried gates.
申请公布号 US4528745(A) 申请公布日期 1985.07.16
申请号 US19830511193 申请日期 1983.07.06
申请人 TOYO DENKI SEIZO KABUSHIKI KAISHA 发明人 MURAOKA, KIMIHIRO
分类号 H01L21/20;H01L21/225;H01L21/28;H01L21/335;H01L29/10;(IPC1-7):H01L21/20;H01L21/74 主分类号 H01L21/20
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