| 摘要 |
<p>A heat-resistant resin composition suitable for use in multilayer super high density printed circuit boards, comprising a polyaminobismaleimide, a polyepoxy compound, and an aromatic vinyl copolymer containing as structural unit maleic anhydride and/or an alkyl maleate. This resin composition is excellent in thermal resistance and dimensional stability, which are important properties of a resin composition for practical use in lamination, and when used in lamination, exhibits favorable flow and curing properties so that it can be easily and economically processed under conventional laminating conditions. When used as a multilayer printed circuit board material, it is also characterized by excellent adhesion to a copper foil, particularly in bonding an inner circuit copper foil to the board. Although particularly suitable for use in multilayer printed circuit boards of numerous layers (eight or more layers) bearing highly packed circuits and as an interlayer adhesive sheet, the present resin composition can be used in general heat-resistant printed circuit boards and in general heat-resistant structural laminates.</p> |
