发明名称 HEAT-SENSITIVE ADHESIVE
摘要 PURPOSE:To provide a heat-sensitive adhesive exhibiting excellent adhesion under mild bonding conditions, consisting of a modified ethylene/vinyl acetate/carbon monoxide copolymer modified by grafting an alpha,beta-ethylenically unsaturated carboxylic acid or anhydride onto said copolymer. CONSTITUTION:A heat-sensitive adhesive consists of a modified copolymer obtd. by grafting an alpha,beta-ethylenically unsaturated carboxylic acid or anhydride [e.g. (meth)acrylic acid or maleic anhydride] onto a copolymer composed of 40- 60wt% ethylene, 15-60wt% vinyl acetate and 3-30wt% CO. This adhesive can be applied to various substrates such as PE, PS and polyester films and sheets, aluminum foil, paper, wood, etc. under wide bonding conditions (temp., pressure, time, etc.) and under mild bonding conditions and can retain high-level adhesion over a long period of time irrespective of the type of the substrates.
申请公布号 JPS60158282(A) 申请公布日期 1985.08.19
申请号 JP19840013015 申请日期 1984.01.27
申请人 MITSUI DEYUPON PORIKEMIKARU KK 发明人 FUKUDA MITSUHARU;ADACHI YUKIO;HIRASAWA EISAKU
分类号 C08F283/00;C09J131/04 主分类号 C08F283/00
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