发明名称 BONDING METHOD
摘要 PURPOSE:To free an outer panel from the problem of causing distortion, by elevating the temp. of an inner panel to a point higher than that of an outer panel and curing an adhesive interposed between both panels by heating. CONSTITUTION:An outer panel 1 composed of a board made of a 30% glass fiber-filled unsaturated polyester resin is bonded to an inner panel 2 with a two- pack urethane adhesive 3. The adhesive 3 is cured by heating it under such conditions that the temp. of the inner panel 2 is higher by 50 deg.C than that of the outer panel 1, whereby the outer panel 1 is bonded to the inner panel 2. During the course of the curing of the adhesive 3, the rigidity of the outer panel 1 is kept higher than that of the inner panel 2 and a 1-5% reduction in the volume of the adhesive 3 caused by the curing can be absorbed by the inner panel 2 so that the outer panel 2 hardly cause distortion.
申请公布号 JPS60202178(A) 申请公布日期 1985.10.12
申请号 JP19840057233 申请日期 1984.03.27
申请人 MITSUBISHI JIDOSHA KOGYO KK 发明人 IWAMOTO KATSUTOSHI;NAKAZATO KAZUYUKI
分类号 B62D25/00;B29C65/00;B29C65/48;B62D25/10;C09J5/00;C09J5/06 主分类号 B62D25/00
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