| 摘要 |
PURPOSE:To improve the thermal conductivity of a substrate, and to load a pellet with high density by forming the substrate by silicon carbide containing a small amount of beryllium. CONSTITUTION:A plurality of pellets 3 are formed on a substrate 1 shaped by silicon carbide containing a small amount of beryllium through bump electrodes 2 formed by solder. The pellets 3 are sealed by a cap 5 mounted onto the substrate 1 by adhesives 4 using an silicone rubber. Electrodes 6 for leading-out to the outside are fitted to the substrate 1 and radiator fins 8 to the back of the substrate 1 by adhesives 7 in which the silicone rubber is filled with filler material, such as alumina, silica, etc. |
