| 摘要 |
<p>PURPOSE:A photocurable resin composition excellent in adhesion to substrates, especially, to the surface of metal or glass, prepared by adding a specified organic compound and a photopolymerization initiator to a polyfunctional epoxy compound. CONSTITUTION:Use is made of a urea compound of the formula (wherein R1 and R2 are each a 1-10C alkyl, 1-10C alkenyl, a 6-8C aryl, or a 7-9C aralkyl or R1 and R2 may be combined together to form a ring, X and Y are each H, a halogen, methyl, methoxy or nitrol) and a like compound. Namely, 100pts.wt. epoxy compound (e.g., bisphenol A-derived epoxy resin) is mixed with 10-300pts.wt. at least one compound selected from among a compound having at least two polymerizable unsaturated groups and a compound having an epoxy group and a polymerizable unsaturated group (e.g., ethylene glycol), 0.3-1.5pts. wt. organic acid hydrazide compound (e.g., salicylic acid hydrazide), 0.3-10pts. wt. above urea compound (e.g., 3-phenyl-1,1-dimethylurea), and 0.5-20pts.wt. photopolymerization initiator.</p> |
