发明名称 Photosensitive insulated resin composition and method of producing insulated film thereof
摘要 The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60.
申请公布号 US9529260(B1) 申请公布日期 2016.12.27
申请号 US201615099493 申请日期 2016.04.14
申请人 eChem Solutions Corp. 发明人 Chang Che Wei;Chung Ming Che
分类号 G03F7/023;G03F7/40;G03F7/022;G03F7/038;G03F7/16 主分类号 G03F7/023
代理机构 代理人 Shen Li-Jen
主权项 1. A photosensitive insulated resin composition, comprising: an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60.
地址 Taoyuan TW