发明名称 |
Photosensitive insulated resin composition and method of producing insulated film thereof |
摘要 |
The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60. |
申请公布号 |
US9529260(B1) |
申请公布日期 |
2016.12.27 |
申请号 |
US201615099493 |
申请日期 |
2016.04.14 |
申请人 |
eChem Solutions Corp. |
发明人 |
Chang Che Wei;Chung Ming Che |
分类号 |
G03F7/023;G03F7/40;G03F7/022;G03F7/038;G03F7/16 |
主分类号 |
G03F7/023 |
代理机构 |
|
代理人 |
Shen Li-Jen |
主权项 |
1. A photosensitive insulated resin composition, comprising:
an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60. |
地址 |
Taoyuan TW |