| 摘要 |
Provided is a method for manufacturing a chip-scale luminescent assembly. The manufacturing method comprises: providing surface-modified luminescent powder (31), the surface-modified luminescent powder (31) comprising at least one type of luminescent powder (1) or at least one type of granules (2) or liquid-state film bodies (3) coating the luminescent powder (1); and fixing, by using a fixed procedure, the surface-modified luminescent powder (31) on a substrate to form a chip-scale luminescent assembly, surfaces or five sides of the chip-scale luminescent assembly having a luminescent powder. |
