| 摘要 |
<p>Electrical components, e.g. semiconductor devices, are encapsulated by an injection moulding process. The devices (5), each provided with a cover (4) and mounted on a bandolier (3) are fed into a mould (2). Plastics material is injected from one or two injection points and at a specified angle in relation to the bandolier such that the pressures acting on the device (5) are substantially uniform in all directions. <IMAGE></p> |
