ULTRASOUND ASSISTED IMMERSION COOLING

摘要

Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

主权项

1. An apparatus comprising:
a tank to hold a dielectric fluid and one or more heat-generating components; and a transducer located external to and coupled with the tank, the transducer to generate an ultrasound wave that controls movement of the dielectric fluid at a location within a vicinity of at least one of the one or more heat-generating components within the tank.