| 摘要 |
PURPOSE:To improve the accuracy of size and productivity by molding incorporatedly a synthetic resin layer having a concaved part by the injection molding to an upper face of a flat plate made of a synthetic resin or metal to form a card base and imbedding and fixing an IC base to the concaved part of the card base. CONSTITUTION:Lots of external terminals 12 for connection are provided to the upper face of a base 11 made of glass epoxy of the IC base 1, and an IC chip 13 comprising two chips, a ROM and a microprocessor is molded and mounted on the lower face. Further, lots or printed wirings 14 are provided to the lower face of the base 11 and the IC chip 13 is connected to the external terminals 12 via the print wirings 14. In the card base 2, a synthetic resin layer 2b having a recessed part 3 is formed to the upper face of the flat plate 2a made of synthetic resin such as ABS resin or made of a metal such as stainless steel by the injection molding, and the IC base 1 is imbedded and fixed to the recessed part 3. |
