| 摘要 |
PURPOSE:To reduce the contacting data of a semiconductor wafer with a support and prevent contamination from the contacting part, and to improve the precision of analysis by supporting only the outer peripheral edge of the lower part of the semiconductor wafer at an engaging part and then decomposing it. CONSTITUTION:A support 12 which supports the semiconductor wafer having a thin film semiconductor on the surface upright and a chemical container which evaporates chemicals for decomposing the thin film semiconductor are arranged in a sealed container to constitute a decomposing device. The support 12 has the engaging part 13 which supports the semiconductor wafer 7 in contact with its lower outer peripheral edge and a decomposed liquid receptacle part 15 where the decomposing liquid from the semiconductor wafer supported by the engaging part 13 is reserved. The receptacle part 15 has slanting surfaces 16 formed from boht sides to the center and the decomposing liquid when falling from the slanting surface 16 is collected speedily at the center part. Thus, the majority of the semiconductor wafer 7 does not contact the support 12 and the area of contacting with chemicals increases, so that the film semiconductor is decomposed speedily.
|
