| 摘要 |
<p>PURPOSE:To obtain a mask plate for manufacturing a semiconductor device which can define the width of a facet cut portion of a wafer, by constructing the plate of a belt-shaped transparent element provided adjacently to a pattern element and a mask element provided adjacently on the opposite side to the pattern element. CONSTITUTION:A mask plate 10 is formed, on a glass plate 11, of a pattern element 12 with a pattern drawn for forming ordinary layers on a wafer, a belt-shaped transparent element 13 provided adjacently to said pattern element 12 and further a belt-shaped mask element 14 provided adjacently to the outside f said transparent element 13. The wafer 1 being moved under the mask plate 10, an orientation flat 2 of the wafer 1 is matched with the edge 14a of the mask element 14 by visual observation from above the transparent plate 13. Then, a light is projected from above the mask plate 10. Thereby the wafer 1 is cut by the width (t) of the transparent element 13 from the orientation flat 2, and thus a facet cut portion having a definite width is formed constantly.</p> |
