| 摘要 |
PROBLEM TO BE SOLVED: To provide a support jig for plating a semiconductor wafer which facilitates handling of a thin semiconductor wafer to be plated with a plating liquid, can prevent cracking by protection of a brittle peripheral portion of the semiconductor wafer, and gives a little adverse effect on a plating treatment due to contamination in the peripheral portion of the semiconductor wafer.SOLUTION: A support jig for plating protects the rear face and the peripheral portion of a semiconductor wafer 1 when the semiconductor wafer 1 which has a circuit pattern 2 formed thereon, has a thickness of 100 μm or less, and is easily bent is immersed in a plating liquid; and includes a support ring 10 that accommodates the semiconductor wafer 1 and is formed of a resin, an elastic holding layer 13 that is stretched on a surface peripheral edge portion 12 of the support ring 10, covers a hollow portion 11 of the support ring 10, and holds the semiconductor wafer 1 from the rear face side thereof, and an adhesive ring 15 that is adhered to a surface peripheral edge portion 14 of the elastic holding layer 13, and is adhered to a surface peripheral edge portion 3 of the semiconductor wafer 1 held by the elastic holding layer 13. |
