发明名称 MOLDING EQUIPMENT
摘要 PURPOSE:To prevent lowering of the temperature of a molding tool by interrupting contact with a flow of a fluid, by covering the outside of the molding tool with a radiation prevention member. CONSTITUTION:In case of molding of a package to be airtight-sealed which seals an IC as an article to be sealed, clean air is blown away to maintain a cleaning state at a parting face between cavity blocks 9, 15 of a top and bottom forces 7, 13. As the outsides of the top and bottom forces 7, 13 are covered with heat insulation plates 10, even is the clean air is blown against the top and bottom forces 7, 13, cooling of the top and bottom forces is controlled and ununiformity of a temperature distribution is each of parts of the top and bottom forces which results from the foregoing matter is controlled. Therefore, ununiformity in thermal cure of resin resulting from the ununiformity of the temperature distribution is prevented and generation of dispersion in products is avoided.
申请公布号 JPS61270126(A) 申请公布日期 1986.11.29
申请号 JP19850110457 申请日期 1985.05.24
申请人 HITACHI TOKYO ELECTRON CO LTD;HITACHI LTD 发明人 MOMOTA MITSUHIRO;YAMADA TADASHI
分类号 H01L21/56;B29C33/38;B29C45/02;B29C45/14;B29C45/26;B29C45/73;B29K101/10;B29L31/34 主分类号 H01L21/56
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