发明名称 Light emitting device and method for manufacturing same
摘要 A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
申请公布号 US9484511(B2) 申请公布日期 2016.11.01
申请号 US201414274872 申请日期 2014.05.12
申请人 NICHIA CORPORATION 发明人 Suenaga Ryoma;Tamaki Hiroto
分类号 H01L33/62;H01L33/00;H01L33/36;H01L23/00;H01L33/48 主分类号 H01L33/62
代理机构 Global IP Counselors, LLP 代理人 Global IP Counselors, LLP
主权项 1. A method of manufacturing a light emitting device comprising: mounting a terminal substrate on a light emitting element individually arranged on a support from above the light emitting element with respect to a direction of gravity, with the light emitting element including a semiconductor laminate, which includes a first semiconductor layer, a light emitting layer and a second semiconductor layer laminated in that order on the support, so that at least a part of the outer edge of the terminal substrate is disposed more to the inside than the outer edge of the first semiconductor layer of the light emitting element in plan view.
地址 Anan-shi JP
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