| 摘要 |
<p>PURPOSE:To drop the adhesive force of a dicing film to easily take out chips by a method wherein the adhesive layer consisting of an adhesive and fillers is formed on one surface of the extensible plastic base film and the relations between the thickness of the adhesive layer and the average particle diameter of the fillers are specified. CONSTITUTION:The base film of extensible plastic film, strong in adhesive force at normal temperature at which usually the chips can not easily be taken out can be used as the adhesive, and the fillers are granular organic substances or inorganic substances. The fillers used is selected and the thickness of the adhesive layer 2 is set so that the relations between the thickness T (at the time of non-extension) of the adhesive layer and the average particle diameter D of the fillers desirably meet the conditions of 0.5T<=D<=0.8T. If the D is larger than the T, the fillers protrude from the adhesive layer even at the time of non-extension of the dicing film and the adhesive force thereof at the time of fixing of the wafer weakens. If the D is smaller than 30% of the D, the fillers completely cease from squeezing out from the adhesive layer even through the dicing film is extended.</p> |
