| 摘要 |
PURPOSE:To improve the performance of a device without heating other parts by making laser light incident on a glass ball sucked atop a vacuum suction nozzle. CONSTITUTION:The glass ball 14 is mounted through solder 15 at a specific position on a metallic substrate 13 to which a semiconductor laser element 12 and a heat sink 11 are fitted. An optical fiber element wire 17 is supported by a base and a metallic fixture 21 and sucked by a vacuum pump through its discharge port 23 to suck the ball 14 to the suction port 22 atop of the suction nozzle 24; and the laser light projected from the element wire 17 is converged through lens effect and heats a metallized part 16 to fuse the solder 15. For the purpose,the position of the ball 14 is adjusted while the element 12 is put in operation and the ball is bonded instantaneously at the optimum position to improve the performance of the device without heating other parts. |
