发明名称 THERMAL STENCIL BASE PAPER
摘要 PURPOSE:To prevent heat fusion of a film to a thermal head when a thermal stencil base paper is perforated, by a method wherein an anti-sticking layer containing any one or more of a polypropylene glycol and a polyethylene glycol/ polypropylene glycol block copolymer, or that containing a polyethylene glycol in addition to one or more of the above contents is formed on the surface of the polyester film. CONSTITUTION:A polypropylene glycol and a polyethylene glycol/polypropylene glycol block copolymer with molecular weights ranging 5,000-20,000 are preferable, because those of higher molecular weight deteriorates in its solubility to water. These substances dissolved in water is coated on the film, preferably 0.05-0.3g/m<2> in amount, together with a wetting agent including a surface-active agents of nonionic, anionic, or cationic series, and thereafter dried to form an anti-sticking layer. The polyester film of not more than 4mum thick is desirably used and a porous tissue or the like is used as a substrate therefor.
申请公布号 JPS6233691(A) 申请公布日期 1987.02.13
申请号 JP19850173250 申请日期 1985.08.08
申请人 RICOH CO LTD;GENERAL KK 发明人 WATANABE HIROO
分类号 B41N1/24;(IPC1-7):B41N1/24 主分类号 B41N1/24
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