发明名称 SOLID STATE IMAGE PICKUP DEVICE AND CAMERA MODULE
摘要 PROBLEM TO BE SOLVED: To provide a solid state image pickup device and a camera module capable of acquiring high quality images with little unevenness in resolution.SOLUTION: A solid state image pickup device in an embodiment includes an image pick-up device 11. The image pick-up device 11 includes pixels formed thereon, which are arranged in a matrix. The image pick-up device 11 includes a light receiving plane 30 on which light enters and proceeds to the pixels. The light receiving plane 30 has an area 31 as a first area and an area 32 as a second area. The first area includes a center position O of the light receiving plane 30. The second area is located between the first area and an outer edge of the light receiving plane 30. The first area has a spherical shape and the second area has an aspherical shape.SELECTED DRAWING: Figure 4
申请公布号 JP2016197661(A) 申请公布日期 2016.11.24
申请号 JP20150077103 申请日期 2015.04.03
申请人 TOSHIBA CORP 发明人 OGASAWARA TAKAYUKI;KAJI NOBUAKI
分类号 H01L27/14;G02B7/02;G02B13/18;H04N5/225 主分类号 H01L27/14
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