发明名称 |
SOLID STATE IMAGE PICKUP DEVICE AND CAMERA MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a solid state image pickup device and a camera module capable of acquiring high quality images with little unevenness in resolution.SOLUTION: A solid state image pickup device in an embodiment includes an image pick-up device 11. The image pick-up device 11 includes pixels formed thereon, which are arranged in a matrix. The image pick-up device 11 includes a light receiving plane 30 on which light enters and proceeds to the pixels. The light receiving plane 30 has an area 31 as a first area and an area 32 as a second area. The first area includes a center position O of the light receiving plane 30. The second area is located between the first area and an outer edge of the light receiving plane 30. The first area has a spherical shape and the second area has an aspherical shape.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016197661(A) |
申请公布日期 |
2016.11.24 |
申请号 |
JP20150077103 |
申请日期 |
2015.04.03 |
申请人 |
TOSHIBA CORP |
发明人 |
OGASAWARA TAKAYUKI;KAJI NOBUAKI |
分类号 |
H01L27/14;G02B7/02;G02B13/18;H04N5/225 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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