发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:The composition providing a cured material having improved thermal shock resistance, comprising an epoxy resin, a novolak phenolic resin, a phenol aralkyl resin and finely divided polyester elastomer powder in a specific ratio. CONSTITUTION:The aimed composition comprising (A) 100pts.wt. epoxy resin (e.g., bisphenol A type epoxy resin, etc.,) containing at least two epoxy groups in one molecule (e.g., bisphenol A type epoxy resin, etc.), (B) 10-50pts.wt. novolak type phenolic resin (preferably having 80-100 deg.C softening point and 100-110 hydroxyl group equivalent), (C) 10-50pts.wt. phenolic aralkyl resin (resin having 85-105 deg.C softening point and 195-235 hydroxy group equivalent) in the total amounts of the component B+C of 50-90pts.wt. and (D) 2-40pts.wt. polyester elastomer powder (having 140-220 deg.C melting point) having <=250mum particle diameter.</p>
申请公布号 JPS6272713(A) 申请公布日期 1987.04.03
申请号 JP19850212606 申请日期 1985.09.27
申请人 TOSHIBA CORP 发明人 YOSHIZUMI AKIRA;MATSUMOTO KAZUTAKA;UCHIDA TAKESHI;AZUMA MICHIYA
分类号 C08G59/00;C08G59/62;C08L63/00;C08L67/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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